Ceva Appoints Former Intel Executive to Lead Connectivity Strategy
Ceva has created a new executive role to consolidate its connectivity, sensing, and CTO functions under veteran semiconductor leader Ziv Hammer, signaling a strategic push into Physical AI.
Ceva (CEVA) has appointed Ziv Hammer as Executive Vice President, Connectivity & Sensing, a newly created position designed to unify the company's connectivity and sensing businesses with its CTO Office. Reporting directly to CEO Amir Panush, Hammer will oversee the Wireless IoT, Mobile Broadband, and Sensing & Audio Software divisions. This structural change centralizes technical leadership to better serve customers seeking customized system solutions, particularly in the emerging Physical AI sector.
The appointment leverages Hammer’s more than two decades of experience in wireless connectivity, secure IoT, and silicon IP. Previously serving at Intel, Infineon Technologies, and GlobalFoundries, he led global engineering organizations of over 1,000 employees. His recent role as Senior Vice President of Design Platforms and Services at GlobalFoundries involved managing the lifecycle of complex semiconductor designs from concept to production, a skill set Ceva aims to apply to its expanding edge-compute portfolio.
Consolidating Technical Leadership Functions
By merging the CTO Office with the connectivity and sensing divisions, Ceva aims to streamline its engineering pipeline. CEO Amir Panush stated that this integration allows the company to align its technology roadmap more closely with customer needs for sophisticated system solutions. The move is intended to strengthen Ceva's ability to differentiate products in the smart edge market by ensuring that hardware and software IP are developed in a coordinated manner.
Hammer’s background in leading large-scale engineering teams across compute and connectivity sectors provides Ceva with operational depth. His experience at GlobalFoundries, where he worked across technology, IP, and design enablement, is directly applicable to Ceva’s model of providing silicon and software IP. This consolidation is expected to enhance the company's execution capabilities and customer engagement, particularly for partners looking to integrate AI-driven features into their devices.
Strategic Focus on Physical AI
Ceva is positioning its portfolio to address the growing demand for intelligent and connected devices, a trend identified by Hammer as reshaping the semiconductor industry. The new executive structure supports this shift by focusing on the intersection of connectivity, sensing, and inference. Hammer, based in Silicon Valley, will work closely with customers to translate emerging requirements into differentiated products, leveraging Ceva’s existing technology momentum.
According to reporting from GN stocks/chips, this leadership change underscores Ceva’s commitment to the Physical AI opportunity. By placing a veteran executive with deep technical expertise in charge of these critical functions, the company aims to deepen its engagement with partners and ensure its AI fabric portfolio remains aligned with market opportunities. The strategy relies on Hammer’s ability to build world-class organizations and bring complex technologies to market efficiently.
