Ceva Partners with LG Electronics to Launch Silicon-Ready UWB Solution
Ceva's new UWB platform with LG targets the 1.18 billion device market by 2030, leveraging a major US semiconductor client for early validation.
Key points
- Ceva and LG Electronics have combined UWB IP and RF technology to create a silicon-ready solution for next-gen devices.
- A major U.S. semiconductor company has selected the combined solution, providing early commercial validation.
- ABI Research forecasts global UWB device shipments will grow from 597 million in 2026 to 1.18 billion by 2030.
Ceva Inc. has entered a strategic collaboration with LG Electronics to deliver a complete, silicon-ready ultra-wideband (UWB) solution. The partnership combines Ceva-Waves’ UWB baseband intellectual property and software with LG’s radio-frequency technology, designed specifically for semiconductor and original equipment manufacturers developing next-generation connected devices.
This move positions Ceva to capture value from the expanding edge AI market, where devices require precise positioning and sensing capabilities. According to Zacks Investment Research, the combined platform is already selected by a major U.S. semiconductor company, providing early commercial validation of the technology’s integration into high-volume production.
LG partnership reduces integration risk
The solution supports TSMC’s 22-nanometer manufacturing process, allowing customers to reduce engineering requirements and accelerate time to market. By pairing Ceva’s next-generation UWB architecture with LG’s RF technology, the platform offers improved ranging performance in non-line-of-sight environments, low-power operation, and resistance to interference.
This integrated approach lowers integration risks for chipmakers, enabling them to deploy secure access, asset tracking, and indoor navigation features more efficiently. The architecture complies with the latest IEEE 802.15.4ab standard, ensuring compatibility with emerging industry requirements for secure and precise positioning.
Global UWB shipments to double by 2030
ABI Research projects that worldwide UWB device shipments will rise from 597 million units in 2026 to nearly 1.18 billion by 2030. This growth trajectory creates significant licensing and royalty opportunities for Ceva as more semiconductor manufacturers integrate UWB capabilities into their chips.
The expanding addressable market is driven by the adoption of UWB in advanced applications beyond digital keys, including radar sensing and precise positioning for AI-enabled devices. Ceva’s broader connectivity portfolio, which includes Bluetooth, Wi-Fi, cellular IoT, and 5G, benefits from this increased demand for robust sensing and connectivity solutions across automotive, industrial, and consumer sectors.
Strategic focus on edge AI capabilities
Ceva’s technology stack is tailored for edge AI adoption, where devices must connect, sense their surroundings, and make real-time decisions. The LG partnership enhances Ceva’s competitive position by expanding its UWB capabilities, supporting the development of intelligent, connected products across multiple end markets.
As the industry shifts toward more sophisticated sensing and positioning standards, Ceva’s role as a key IP provider becomes more critical. The company’s ability to deliver silicon-ready solutions that reduce customer engineering burdens places it in a favorable position to benefit from the sustained growth in UWB integration.
