Qualcomm Secures $60 Billion AI Chip Deal With Amazon
Qualcomm has locked in a $60 billion deal with Amazon to co-develop AI data center chips, a strategic move to diversify away from mobile reliance. New details reveal the partnership focuses on high-efficiency inference hardware, utilizing Qualcomm's HBC technology to optimize token-per-watt performance for hyperscalers.
According to GN technics/hardware, Qualcomm is targeting the inference market with its new AI200 and AI250 accelerators, which leverage a novel High-Bandwidth Compute (HBC) memory stacking technique to achieve 133 TB/s of bandwidth while maintaining low power consumption.
Source: GN technics/hardware (en-US)Qualcomm has secured a massive contract with Amazon to supply AI data center chips, marking a significant strategic pivot for the company as it seeks to reduce its heavy reliance on smartphone manufacturers.
Source: GN technics/mobile (en-US)
