LG Secures NVIDIA Certification for 2.5MW Cooling Unit

LG Electronics expands its partnership with Microsoft to supply critical cooling infrastructure for AI data centers.
Key points
- LG Electronics received NVIDIA's 'DSX Ready' certification for its 2.5-megawatt cooling distribution unit.
- LG and Microsoft expanded their partnership to include AI data center infrastructure and enterprise AI transformation.
- LG plans to supply high-capacity liquid cooling solutions to support Microsoft's global data center expansion.
LG Electronics has strengthened its position in the artificial intelligence infrastructure market by securing a key technical certification from NVIDIA. This approval for a high-capacity liquid cooling unit allows the company to integrate its hardware directly into the data center platforms used by major global tech firms.
Simultaneously, LG announced a broadened strategic partnership with Microsoft to supply power, cooling, and IT solutions. According to chosun.com, this collaboration aims to support the rapid expansion of AI data centers, where traditional air cooling systems are no longer sufficient to manage the heat generated by advanced processing units.
NVIDIA certification validates cooling capacity
The core of this technical advancement is the 'DSX Ready' certification granted to LG’s 2.5-megawatt cooling distribution unit. This designation confirms that the equipment meets the strict power, cooling, and network requirements for NVIDIA’s AI Factory platform. Previous certifications for 600-kilowatt and 1-megawatt units show a clear trajectory toward handling increasingly dense server loads.
This certification is not merely a badge of compliance; it is a prerequisite for entering the supply chains of top-tier AI developers. As AI servers consume more electricity, the physical infrastructure must dissipate heat more efficiently. LG’s ability to provide this high-capacity cooling solution positions it as a critical vendor in a market where hardware reliability is paramount.
Strategic alliance with Microsoft deepens
LG and Microsoft have agreed to collaborate on three specific fronts: AI data center infrastructure, enterprise transformation, and physical AI. In the short term, LG will supply high-capacity cooling solutions to key Microsoft data centers. Looking further ahead, the companies plan to cooperate on prefabricated data centers, where modules are assembled in factories before being installed on-site.
This partnership extends beyond hardware. LG intends to adopt Microsoft’s cloud infrastructure and productivity tools for its own manufacturing, logistics, and mobility operations. By integrating these systems, LG aims to streamline its internal processes while simultaneously serving as a supplier for Microsoft’s external infrastructure needs.
Shift from air to liquid cooling
The move toward liquid cooling represents a fundamental shift in data center design. As AI chips become more powerful, they generate heat that air-based systems cannot dissipate quickly enough. LG is expanding its 'chip-to-chiller' solution, which covers the entire cooling process from the cold plates directly attached to the chips to the larger chillers that circulate coolant.
However, this transition carries significant trade-offs. Liquid cooling systems are more complex to install and maintain than traditional air cooling. They require specialized pipes, pumps, and leak detection systems, which can increase upfront capital costs and operational complexity. Despite these challenges, the industry consensus is that liquid cooling is indispensable for scaling AI workloads, making LG’s certified hardware a necessary component for future data center builds.






