Onsemi Seeks to Shrink EV Inverters Using New Silicon Packaging
Onsemi is introducing a new power platform that uses the silicon wafer itself as a structural base. This approach aims to make electric vehicle inverters significantly smaller and more efficient, though real-world performance data is still pending.
Onsemi has unveiled a new technology called the Embedded Power Platform, designed to fundamentally change how power electronics are built for electric vehicles. The core innovation lies in using the silicon wafer itself as the foundation of the component package, rather than treating it as a temporary carrier. This structural shift allows multiple semiconductor technologies, including silicon, silicon carbide, and gallium nitride, to be integrated into a single, compact unit. According to GN auto tech/ev: electric vehicle, this method promises to quadruple the power density of EV inverters while reducing power losses by up to 15 percent. The primary goal is to create inverters that are both smaller and lighter, which is a critical factor for vehicle design and range.
The practical benefit for consumers is a potential reduction in the overall size and weight of the vehicle's powertrain components. By integrating field-effect transistors, drivers, and controllers into one package, the system reduces electrical losses and allows for higher switching frequencies. However, the manufacturer has not yet provided specific data on how these theoretical gains translate into real-world driving conditions. Subaru has been named as the first automotive partner to evaluate the technology and will receive early engineering samples. It is important to note that no decision has been made regarding its use in a production vehicle, and the technology is currently in an early phase with initial samples expected later this year.
Wafer-based packaging changes manufacturing
Traditionally, semiconductor components are assembled in a way that treats electrical, thermal, and mechanical properties as separate challenges. Onsemi’s new approach allows these factors to be optimized within a unified architecture. Because the wafer serves as the base, key integration steps can occur directly within existing 12-inch silicon wafer production lines. This scalability is a significant advantage, as it allows vehicle manufacturers to use a common base design across different power classes. Instead of developing separate solutions for each model, automakers could potentially reduce development cycles and lower production costs.
Applications extend beyond electric cars
While traction inverters in electric vehicles are the primary target, Onsemi is also targeting industrial applications and power supplies for AI data centers. The company believes that scaling the same integration architecture across different sectors offers a strategic advantage. For the platform as a whole, Onsemi cites a three- to five-fold increase in power density depending on the specific application. In some cases, development cycles could be shortened to as little as four months. However, these figures apply to the platform broadly and do not specifically represent a validated automotive series application, meaning there is still a gap between laboratory performance and certified vehicle readiness.
